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    ESD防护芯片
    ESD防护芯片

    Product status

    Unidirectional/bidirectional

    Channel

    Top Metal

    Back Metal

    Die Size

    Die Size (Width/um)

    Wafer Saw(um)

    Thickness(um)

    Vrwm(V)

    Vbr(V@1mA)

    IR(uA)

    Cj(pf)

    Ipp(A)

    Vcc(V@Ippmax)

    ESD(kV)

    ??
    型号 pdf Unidirectional
    /bidirectional
    Channel Top Metal Back Metal Die Size (Length/um) Die Size (Width/um) Wafer Saw(um) Thickness(um) Vrwm(V) Vbr(V@1mA) IR(uA) Cj(pf) Ipp(A) Vcc(V@Ippmax) ESD(kV) 产品状态

    条数据

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